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ICES675

COMe 为工业相关应用提供可靠的嵌入式平台，是客制化的理想选择，同时减少项目进度和成本

主要特点
  • 第八代Intel® Core™ 处理器, BGA 1440, PCH CM246
  • 支持双通道DDR4带ECC或非ECC SO-DIMM 2666MHZ内存，最大32GB
  • 支持三重显示VGA, 2 x DP, eDP/LVDS 24bit双通道
  • PCI Express Lane x16 (可配置：“1 x16” ; “2 x8” ; “1 x8 + 2 x4”)
  • PCI Express Lane x1 (Gen 3), 8x (可配置：x1, x4)
  • I/O: 2 x UART(RX/TX), 8 Bit DIO, WDT, TPM（可选）

Overview

ICES675系列COM Express Type 6基本型计算模块，采用Intel® C240系列PCH芯片组，支持第8代Intel®，Intel® Xeon®和Intel® Core™处理器，双通道DDR4带ECC或非ECC SO-DIMM 2666MHZ，最高32GB。ICES675集成Intel® HD Graphics引擎支持或通过PCI Express Graphic 1 x 16通道进行扩展，并支持三个DDI（数字显示接口），遵循PICMG COM2.0规范的标准。它支持6引脚载板实现DDI和传统VGA接口。

ICES675支持多种处理器：Intel® Xeon® E-2176M处理器（支持ECC）和Intel® Core™ i5-8400H处理器（非ECC）。

高性能ICES675 COM Express基本型模块为您的嵌入式应用1个GBE LAN, 4个USB3.1 GEN1, 8个USB2.0, 4个SATA3.0, 2个UART(TX/RX), HD Audio, 8 bit DIO, TPM （可选）, ICEB 8060 以及定制的解决方案。

Specifications

CPU / Chipset
  • 8th Generation Intel® Core™ Processors, BGA 1440
    Intel® Xeon® E-2176M Processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W (Support ECC)
    Intel® Core™ i7-8850H Processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W
    Intel® Core™ i5-8400H Processor, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W
  • Intel® Mobile CM246

Main Memory
  • Dual channel DDR4 SO-DIMM memory Socket with non-ECC support, up to 32 GB 2666MHZ, ECC support as option with Intel® Xeon® E-2176M Processor

BIOS
  • AMI (UEFI)

Display
  • Integrated Intel® Gen9 Graphics graphic engine
  • 1 x VGA connector (resolution up to 1920x1080@60Hz)
  • 1 x LVDS connector(resolution up to 1920x1080@60Hz)
  • DDI 1/2 Port configurable to HDMI1.4/DVI/Display port
    1.4  HDMI up to 4096 x 2160@30Hz/24bpp
    DVI up to 1920x1200@60Hz
    DP up to 4096 x 2304 @ 60Hz 

COM Express Connector
  • AB :LVDS:(LVDS/eDP co-lay), VGA:(VGA/DDI port3 co-lay), 1 x GbE LAN, 6x PCIe x1, HD Audio, 4 x SATA III, 8 x USB2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8bit
  • CD : DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB3.0

Power Requirement
  • +12VDC, +5Vsb
  • Support both AT and ATX power supply mode

Dimensions

  • 125mm x 95mm

Environment
  • Board level operation temperture : -0°C to 60°C
  • Storage temperture : -20˚C to 85˚C
  • Relative humidty:
    10% to 95% (operating, non-condensing)
    5% to 95% (non-operating, non-condensing)

Certifications

  • Meet CE / FCC Class B

Ordering Information

Barebone

ICES675(P/N: 10K00067500X0)
On-board Intel® 8th Intel® Xeon® E-2176M Processorr, 2 x DDR4 SO-DIMM(Support ECC), supports multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1x GbE LAN, 2 x COM, 4x USB3.0, 8 x USB2.0, HD Audio, 8bit GPIO

ICES675-8400 (P/N: 10K00067501X0)
On-board Intel® 8th Intel® Core™ i5-8400H Processor, 2 x DDR4 SO-DIMM (Non-ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1x GbE LAN, 2 x COM, 4x USB 3.0, 8 x USB2.0, HD Audio, 8-bit GPIO

ICES675-8400 (P/N: 10K00067502X0)
On-board Intel® 8th Intel® Core™ i7-8850H Processor, 2 x DDR4 SO-DIMM (Non-ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1x GbE LAN, 2 x COM, 4x USB 3.0, 8 x USB2.0, HD Audio, 8-bit GPIO

Optional Accessories

CPU Cooler (P/N: 5050200161X00)

Heat spreader (P/N: TBD)

TPM 2.0 Module KIT (P/N: 79E00TPM01X00)

Download

驅動程序
上传日期 文件名 版本 OS 描述 下载
2020/03/05 ICES675 Chipset 1.0 All OS ICES675 Chipset 4.6 MB
2020/03/05 ICES675 Graphics 1.0 All OS ICES675 Graphics 245.9 MB
2020/03/05 ICES675 ME 1.0 All OS ICES675 ME 102.1 MB
2020/03/05 ICES675 Ethernet 1.0 All OS ICES675 Ethernet 69 MB
2020/03/05 ICES675 Audio 1.0 All OS ICES675 Audio 110.1 MB